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LCM 介绍
LCM Technology
COB
COB (Chip-on-Board) is a popular IC mounting method that provides wire bonding as the direct attachment of bare die to laminated printed circuit boards. The LCD driver is formatted into an area on the PCB. Electrical connections are made by micro diameter gold wires. The entire area is then covered with epoxy. Most of TV standard Character LCD modules are the Chip-On-Board design.
Features:
Space savings over Surface Mount Technology assembly.
Less cost but not good at ESD&EMI.

COG
COG (Chip-On-Glass) is one of the high-tech mounting methods that uses Gold Bump or Flip Chip IC, and implemented in most compact applications. Chip-On-Glass integrated circuits were first introduced by Epson. In flip-chip mounting, the IC chip is not packaged but is mounted directly onto the PCB as a bare chip. Because there is no package, the mounted footprint of the IC can be minimized, along with the required size of the PCB. This technology reduces a mounting area and is better suited to handling high-speed or high-frequency signals.
Features:
Use very commonly in factory.
Chip-On-Glass LCD modules can be as thin as 2 mm.
Cost effective over COB, especially in graphic LCD modules, because much less IC’s are required.

TAB
TAB (Tape Automated Bonding) LCD driver or controller electronics are encapsulated in a thin, hard bubble package, of which the drive leads extend from the bubble package on a thin plastic substrate. The adhesive along the edges is used to attach the TAB to the LCD glass and/or PCB. Tape Automated Bonding IC mounting method uses the same type of integrated circuits as Chip-On-Glass technology - Gold Bumped Flip Chips.
Features:
Can provide interfacing at very fine pitches.
Offer compactness (IC and its interfacing circuitry can be bent behind the LCD glass panel).
The active area is centered (differently from COG).
The bonding area is weak and less reliable than COG.

SMT
SMT (Surface Mounting Technology) using quad flat packages on printed circuit boards was the most popular at the early years of liquid crystal display industry, and is still available for mass production.Plastic Quad Flat Package (QFP) represents itself as a flat rectangular integrated circuit package with its leads projecting from all four sides of the package without radius.
Features:
Good at ESD and EMI.

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